Fujipoly® America announces the release of its new SARCON® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m°K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating components and a nearby heat sink or spreader, the form stable thermal material completely … [Read more...]
Thermal Adhesive Tape with Extremely Low Thermal Resistance Reflects Synergistic Innovation Between DuPont and its Laird Performance Materials Acquisition
The Laird™ Ttape™ 1000A thermally conductive adhesive tape delivers best-in-class thermal resistance WILMINGTON, Del., June 3, 2022 - Laird Performance Materials, part of DuPont Interconnect Solutions, has capitalized on collaborative innovation with DuPont to introduce Laird™ Ttape™ 1000A thermally conductive adhesive tape, a standalone 50µm adhesive that offers extremely … [Read more...]
Thermally Optimizing a High-Power PCB for Battery Powered Electronics
Introduction The growth of battery powered applications is presenting new challenges for designers of electronic motor-driven solutions. Targeting higher performance and efficiency, the power stages of these products must manage high currents while meeting strict power dissipation and size requirements. This article illustrates a thermally aware workflow with Cadence® Celsius™ … [Read more...]
Digital Edge Specifies Nortek’s StatePoint® Liquid Cooling Technology for Upcoming Philippines Data Center
Digital Edge to achieve Power Usage Effectiveness and Water Usage Effectiveness sustainability goals with StatePoint® Oklahoma City, (May 17, 2022)—Digital Edge (Singapore) Holdings Pte. Ltd., (“Digital Edge”), a leading Asian data center developer and operator, leverages StatePoint® liquid cooling technology manufactured by Nortek Data Center Cooling™, Oklahoma City, for … [Read more...]
Arieca Announces $6.5M Series A Funding Round
Company will use the investment to accelerate product development and scale up manufacturing of its Liquid Metal-based thermal interface materials (TIMs). May 17, 2022 8:00 AM Eastern Daylight Time PITTSBURGH--(BUSINESS WIRE)--Arieca Inc., the leader in liquid-metal based thermal interface materials for high performance computing and high power semiconductor devices, … [Read more...]
- « Previous Page
- 1
- …
- 19
- 20
- 21
- 22
- 23
- …
- 356
- Next Page »
