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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Non-Spill Quick Disconnect Couplings Enhance Thermal Management Systems

 

Colder Products Company showcased a broad range of non-spill couplings and solutions for makers of electronic cooling equipment at SEMI-THERM 27. These connectors enable leak-free connection and disconnection of critical fluid lines in liquid cooled servers, chillers and other electronic systems, without the risk of drips or spills. Available for tubing ID ranges from 1/8” … [Read more...]

Thermal Conductive Materials & EM Noise Absorbents

 

Taica’s Alpha Gel’s softness and conformity help minimize heat resistance and stress on critical devices in electronics. K thermal-conductivity material is available, facilitating heat dissipation results. The gel retains the softness and tackiness of its base material. It adheres to rough surfaces, easily compressed, and air gaps could be driven out for efficient thermal … [Read more...]

Low Resistance, Zero Pump-Out Thermal Pad

 

AOS Thermal Compounds’ Microfaze 3 A-4 is a non-silicone thermal pad that exhibits low thermal resistance. It was designed to replace phase change materials and even high performance thermal grease.  The pad is composed of 1 mil films of high thermal conductivity, tacky, but dry-to-the-touch thermal grease on either side of a 2 mil aluminum foil substrate. Learn more from AOS … [Read more...]

30 GHz Leadless Chip Carrier Packaging Platform

 

Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for supporting demands for broadband (DC to 30 GHz), low pin-count ASIC … [Read more...]

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