C&R Technologies (CRTech) has chosen SpaceClaim to be integrated within the CRTech family of products. CRTech SpaceClaim will address complexities in creating thermal models by enabling users to import CAD parts and assemblies from many CAD formats to simplify and heal the geometry and then send it on for meshing. CRTech SpaceClaim will also enable engineers to modify the … [Read more...]
Researchers Developing Silver-Diamond Thermal Shim
Researchers at the Georgia Tech Research Institute are developing a solid composite material, made of silver and diamond to cool small, powerful microelectronics used in defense systems. The diamonds provide the bulk of thermal conductivity, while the silver suspends the diamond particles within the composite and contributes to high thermal conductivity. The research is … [Read more...]
IP to the Pin a Major Trend in Software Technology
IP to the Pin is a software technology that will significantly influence automated test in the coming one to three years, according to National Instruments’ 2011 Automated Test Outlook, a view of key technologies and methodologies impacting the test and measurement industry. Sharing FPGA IP between design and test will dramatically shorten design verification/validation and … [Read more...]
Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 2
These days, many thermal engineers face the challenge of defining effective heat sink cooling solutions for high power processors and ASICs (Application-Specific Integrated Circuits). The usual practice would be to calculate a value of ΘJA (junction-to-air thermal resistance) for the combined package/heat sink assembly and compare it to the requirements of the … [Read more...]
Ultrafast Submicron Thermoreflectance Imaging
K. Yazawa and A. Shakouri Baskin School of Engineering, University of California at Santa Cruz, California Both the miniaturization of electronic and optoelectronic devices and circuits and the increased operation speeds of electronic devices have exacerbated localized heating problems. Steady-state and transient characterization of temperature distribution in devices … [Read more...]
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