Thermal Engineering Associates (TEA) is partnering with engineering services firm, Package Science Services (PSS) to provide measurement, modeling and simulation of IC packages for a number of its customers. The pooling of TEA and PSS resources provides thermal measurement and modeling capability for IC, diode, transistor, LED, and PV devices and related packaging alternatives. … [Read more...]
DoD Extends Contract for Heat Sink Technology
Thermacore was awarded a $3 million Option Phase contract extension by the Defense Advanced Research Projects Agency (DARPA) to continue the development and commercialization of active heat sink technologies for Micro-technologies for Air-Cooled Exchangers (MACE). The original contract had been awarded in December 2008 and is worth $9.5 million. To qualify for the contract … [Read more...]
Groups Develop Thermal Nanotape for Packaging
(a) A nanostructured interface material is used around the module; (b) a nanostructured interface material is used between the thermoelectric material and metal leads. Semiconductor Research Corporation (SRC) and researchers from Stanford University have developed a novel combination of elements that yields a nanostructure material for packaging. The advance could mean … [Read more...]
Beer Fridge – A Case Study in Thermal Design. Part 5 – Time for a FloBEER
All good things come to those who wait. For beer this entails a trade off between anticipation and satisfaction. If, too soon after you put the room temperature beer in the fridge, you get your child to grab a beer for you, your thirst might be quenched but your satisfaction might not be. Wait too long for it to cool down and you might forget you wanted one, or go to sleep, or … [Read more...]
Testing Thermal Interface Material (TIM) Analysis
2-3 p.m., March 10 This webinar will provide an introduction to the most commonly used Thermal Interface Material (TIM) types and their corresponding testing techniques. Basic TIM properties such as bulk or effective thermal conductivity, interfacial thermal resistance and bond line thickness will be explained. At the beginning, an overview of the existing industrial and … [Read more...]
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