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The Uses of Simplicity in Thermal Analysis

 

Bruce Guenin, PhD Editor-in-Chief, Summer 2010 Issue The dramatic trajectory of Moore’s law has produced a number of changes in key areas of technology that are critical to our industry: 1) greater packaging and system complexity; 2) increased power dissipation; and 3) enhanced software tools and computing performance. The first two we put into the challenge category. They … [Read more...]

Calculation Corner: Using Vendor Data to Estimate Thermoelectric Module Cooling Performance in An Application Environment

 

The application of thermoelectric devices to cool electronic components has been of interest to thermal engineers for many years. Thermoelectric (TE) cooling modules offer the potential to either reduce component operating temperatures at a given heat load, or allow higher component heat dissipation at a given temperature level. Readers who are unfamiliar with TE cooling … [Read more...]

Thermal Facts and Fairy Tales: Uncertainty is Assured

 

Do you know the thermal conductivity of paper? This was the start of a phone call a few years ago. The conversation continued and the reason for the question became apparent. A thermal analysis of a printed circuit board had determined that a thermal interface material was needed under some hotter components to provide a better conduction path. The circuit card was edge cooled … [Read more...]

Experimental Methodologies for Thermal Design in Silicon Validation Platforms

 

Rahima K. Mohammed, Yi Xia, Ying-Feng Pang, Ridvan A. Sahan Intel® Corporation Introduction Silicon validation platforms are purpose-built to validate processors, chipsets, and ASICs to ensure world-class quality and reliable products. These platforms are a crucial step in the process of releasing the silicon to market. However, due to growing complexities, it is becoming … [Read more...]

Influence of Motor Supports on Cooling Performance of Small Scale Fans

 

Ed J. Walsh, Jason Stafford & Vanessa Egan Stokes Research Institute, Dept. of Mechanical and Aeronautical Engineering, University of Limerick INTRODUCTION Today’s marketplace consists of many portable computing devices such as personal digital assistants and smart phones. Currently over one billion handset type units are shipped every year. The functionality and power … [Read more...]

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