Introduction By 2008 the electronics content of a typical consumer vehicle had grown to 20-25% of the total vehicle cost [1]. This content provides a wide range of functions and features for today’s driver. Some features such as the radio/audio system and instrument cluster are quite familiar and visible to the driver and have been mainstays in the automobile for many years. … [Read more...]
Carbon Nanotubes as High Performance Thermal Interface Materials
Introduction Because of substantial increases in the power density of electronic packages over the past few decades, thermal interface resistance can comprise more than 50% of the total thermal resistance in current high-power packages [1]. Unless advanced thermal interface materials (TIMs) that achieve order-of-magnitude improvements in performance quickly emerge in the … [Read more...]
a case study to demonstrate the trade-offs between liquid and two-phase cooling schemes for small-channel heat sinks in high heat flux applications
Introduction Small-channel heat sinks provide an extremely compact and efficient vehicle for dissipation of large heat fluxes typically found in high power electronics. Fluid flow and heat transfer in small-sized channels, with hydraulic diameters on the order of a fraction of a millimeter (a few hundred micrometers), have been shown to behave similarly to conventional-sized … [Read more...]
Miniature Environmental Control Unit for Electronics
Aspen Systems has completed the development and military qualification of ECU-Chill™, a ruggedized refrigeration-based environmental control unit (ECU) for cooling electronics in mobile applications. ECU-Chill™ maintains sealed electronics enclosures at or below ambient temperatures, enabling Commercial-Off-The-Shelf (COTS) electronics to be safely and effectively used for … [Read more...]
Thermally Conductive Printed Circuit Board Substrate
Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate system specifically designed for heat dissipation in bright and ultra-bright LED module applications. The thermally conductive PCB substrate provides 8-10 … [Read more...]
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