Introduction Numerous reports over the past ten years or so have described the potential for nanofluids (suspensions of nanoparticles in liquids) to be applied as heat transfer fluids, because of the enhanced thermal conductivity and convective heat transfer characteristics that have generally been observed. A number of review articles have been published on nanofluids [1 � 8], … [Read more...]
Mini- and Microchannels in Thermal Interfaces: Spatial, Temporal, Material, and Practical Significance
Introduction The role of thermal interface materials (TIM) to augment heat flow in electronics has been well-documented [1-4]: Higher thermal conductivity (k) and thinner bondlines proportionally reduce the interface thermal resistance (RTH). Today's high-performance TIMs contain micro- and nanometer-sized particles to increase the effective TIM thermal conductivity (keff,TIM) … [Read more...]
When Moore Is Less: Exploring the 3rd Dimension in IC Packaging
Introduction As consumers of electronics we have become spoiled. We not only expect our electronic devices to get smaller, faster, more functional, cheaper, more interconnected, and more reliable, we actually demand it. It would not be a pretty picture either for the consumer or the electronics industry if suddenly the design of our electronic gadgets became static. At this … [Read more...]
A Cryocooler In Your Laptop Computer? Maybe…
Introduction A review of the technical and market impediments overcome in the development and eventual acceptance of cryocoolers for space-borne applications may shine light on the prospects for the use of such mechanical refrigeration systems in more widespread commercial uses. This premise is explored by first reviewing space cooler development history, then considering some … [Read more...]
Advanced Metal Diamond Composites – Love and Heat Relationship
Introduction Thermal management is a critical issue in high-power laser diode and LED packages, and microprocessor units [1, 2]. Reliability and long life time of electronic packages call not only for materials with high thermal conductivity but also a coefficient of thermal expansion (CTE) matching to that of semiconductors. The thermal expansion of the heat sink material in … [Read more...]
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