Introduction Heat pipes are well-established two-phase devices used in the electronics cooling industry to transport heat from the point it is generated to the place where it is extracted from the system. Three wick structures are most commonly used to provide the capillary path for the liquid return to evaporation section; these are sintered powder, screen mesh and grooved … [Read more...]
A Cryocooler In Your Laptop Computer? Maybe…
Introduction A review of the technical and market impediments overcome in the development and eventual acceptance of cryocoolers for space-borne applications may shine light on the prospects for the use of such mechanical refrigeration systems in more widespread commercial uses. This premise is explored by first reviewing space cooler development history, then considering some … [Read more...]
Advanced Metal Diamond Composites – Love and Heat Relationship
Introduction Thermal management is a critical issue in high-power laser diode and LED packages, and microprocessor units [1, 2]. Reliability and long life time of electronic packages call not only for materials with high thermal conductivity but also a coefficient of thermal expansion (CTE) matching to that of semiconductors. The thermal expansion of the heat sink material in … [Read more...]
Heat of Vaporization
Thermal energy transfer associated with a change of phase can be a valuable phenomenon for engineers designing systems for electronics cooling. Solid to liquid phase change materials were described in the May 2005 Technical Data column and the topic for this issue is liquid to vapor phase change. The energy required to change a substance from a liquid state to a vapor state is … [Read more...]
Heat Spreading Calculations Using Thermal Circuit Elements
Heat Spreading Calculations Using Thermal Circuit Elements Bruce Guenin, Associate Technical Editor Introduction In electronics cooling applications, there are numerous changes of scale from the chip level to the system level. This is characteristic of the signaling, power, and thermal infrastructures in electronic systems. Because of this, it is inevitable that the heat flow … [Read more...]
- « Previous Page
- 1
- …
- 299
- 300
- 301
- 302
- 303
- …
- 356
- Next Page »
