Introduction Readers of ElectronicsCooling know about the rapid pace of technological developments towards an increasingly higher level of miniaturization and, hence, an incredible increase of dissipation power densities. Thus, restating some very well known facts (such as, we have already attained a level of power density that is comparable to nuclear power stations) would not … [Read more...]
On The Challenges of Thermal Characterization of High-Power, High-Brightness LED Packages
Introduction In recent years, high-power, high-brightness Light Emitting Diodes (LEDs) have penetrated into an ever-increasing number of lighting applications. For such devices, maintaining a low die temperature is becoming a huge challenge because of the escalating power density (e.g., 200-300 W/cm2 for the latest generation). Active cooling solutions are rarely considered as … [Read more...]
Thermal Conductivity Of Liquid Metals
This column deals with the thermal conductivity and melting points of liquid metals. Thinking about liquid metals, many people associate them with high temperatures. It is not widely known that some metallic alloys are liquid below 0�C, with the exception of course of mercury which was already known in ancient times. China's first emperor is said to have been buried in rivers … [Read more...]
2U Rack Mountable Vapor Compression Cooling System For High Power Electronics
Vapor compression refrigeration has long been used to cool telecommunications equipment and some high performance computers. On the whole, however, its usage has been confined to high-value, relatively large, and stationary applications. The advantages of vapor compression cooling (VCC) systems are fairly well known. They can provide heat sinks at below ambient temperatures … [Read more...]
Estimating Thermal Resistance For Fin-To-Fin Thermal Couplers
Introduction Most readers of ElectronicsCooling magazine are familiar with the use of fins to increase convective heat transfer area to achieve a lower thermal resistance from a component to the cooling fluid. This Calculation Corner article will address the use of interdigitated fins to provide a mechanically tolerant thermal path between two opposing surfaces (e.g., the back … [Read more...]
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