Small Fans for Cooling Small Electronic Devices Masaharu Miyahara, Sunonwealth Electronic Machine Industry Co., Ltd. The growing portable device market boosts the development of small electric devices, such as Ultra Mobile PC, Pico projector, Smart Phone, etc. One laptop cooling solution is the fan-less cooling technology that transports the CPU heat by using a heat pipe. … [Read more...]
Using a Matrix Inverse Method to Solve a Thermal Resistance Network
Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a project, when the thermal engineer finds it advantageous to perform so called "back of the envelope" calculations without resorting … [Read more...]
Advanced Aerodynamics for Electronics Cooling Fans
Introduction The performance of electronics cooling fans has been steadily increasing as flow requirements chase higher thermal loading. These advances have been primarily achieved through mechanical and architecture changes. However, the aerodynamic sophistication of these fans has progressed to a lesser degree, and is far removed from turbomachines used in higher power … [Read more...]
Cooling Electronics with Nanofluids: Laminar Convective Heat Transfer
Introduction Numerous reports over the past ten years or so have described the potential for nanofluids (suspensions of nanoparticles in liquids) to be applied as heat transfer fluids, because of the enhanced thermal conductivity and convective heat transfer characteristics that have generally been observed. A number of review articles have been published on nanofluids [1 � 8], … [Read more...]
Mini- and Microchannels in Thermal Interfaces: Spatial, Temporal, Material, and Practical Significance
Introduction The role of thermal interface materials (TIM) to augment heat flow in electronics has been well-documented [1-4]: Higher thermal conductivity (k) and thinner bondlines proportionally reduce the interface thermal resistance (RTH). Today's high-performance TIMs contain micro- and nanometer-sized particles to increase the effective TIM thermal conductivity (keff,TIM) … [Read more...]
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