Introduction Many liquid cooling solutions in use today employ cooling system devices that result in system pressure drops limited to <0.5 bar (7.25 psi), which allows these systems to fit within the limits of centrifugal pumps. The evolution of alternative cooling devices has brought about pressure drop requirements >1.0 bar (14.50 psi) in some cases [1]. These higher … [Read more...]
Comparison Of Heat Transfer Rates Of Different Nanofluids On The Basis Of The Mouromtseff Number
Nanofluids are dispersions of nanometer-sized particles in a base fluid such as water, ethylene glycol or propylene glycol. In the last decade, nanofluids have attracted more attention as a new generation of coolants for various industrial and automotive applications. Use of high thermal conductivity metallic nanoparticles (e.g., copper, aluminum, silver, gold, etc.) … [Read more...]
Design For Manufacturability Of Forced Convection Air Cooled Fully Ducted Heat Sinks
Introduction The requisite thermal management for a microprocessor is most often achieved via an aluminum heat sink (fin structure) and a small fan. The effort discussed herein deals with the development of a 'design for manufacturability' methodology for forced convection cooled, plate fin arrays used to form high performance heat sinks for electronics cooling applications. In … [Read more...]
Thermal Diffusivity
Thermal diffusivity is a measure of the transient thermal response of a material to a change in temperature and the term thermal diffusivity (α) is defined asα= k/(ρ x cp) where αis the thermal diffusivity (m2/sec) k is the thermal conductivity (W/m-K) ρ is the density (kg/m3) cp is the heat capacity (J/kg-K) It should be noted that each of these quantities can … [Read more...]
Thermal Strain In Semiconductor Packages, Part I
Introduction Silicon became the semiconductor of choice for ICs because of its electrical properties, not because of its mechanical properties. In the earliest days of ICs when chips were small and power levels were low, the mechanical properties of silicon were of little consequence. However, for some time, the opposite situation has been the norm. Now, there are much larger … [Read more...]
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