Sponsor

Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

Sponsor

Moisture permeation in electronics

 

Environmental control for electronic packages and enclosures often involves understanding and managing moisture concentration. Excessive moisture combined with processing temperatures can cause damage. High humidity levels have other potentially harmful effects such as corrosion. Since the movement of heat and moisture are similar (i.e., diffusive), thermal engineers may be … [Read more...]

Adhesion of Thermal Interface Materials for CPU Heatsinks, an Overlooked Issue

 

High performance thermal interface materials (TIMs) inserted between the CPU lid and heatsink - generally referred to as the "TIM2" - provide a reworkable low resistance thermal path in the package stack-up. It is well-recognized that users need to monitor the thermal performance of the TIMs to verify vendor data [1, 2]. Less well-known is that the TIM2 can also mechanically … [Read more...]

Microscale heat transfer

 

Advances in microfabrication processes have led to a continuous miniaturization of Field Effect Transistors (FET) that contain semiconductor (e.g., silicon), insulator (e.g., silicon dioxide), and metallic (e.g., copper interconnects) layers only a few nanometers thick. Ever increasing demand for faster microprocessors and the continuous trend to pack more transistors on a … [Read more...]

Piezo actuators for electronics cooling

 

Introduction Today, there is a specific demand by the electronics consumer market: more devices using low power processors with multiple simultaneous CPU functions. Due to the significant demand in computing needs, the International Technology Roadmap for Semiconductors (ITRS) 2005 predicts an increase in the overall power consumption for some platforms [1]. The cooling issues … [Read more...]

Industry Sponsors

Sponsor
Sponsor