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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Synthetic jets for forced air cooling of electronics

 

Introduction As increasing functionality is packaged into ever-shrinking electronics, cooling requirements rise exponentially. While there have been continued advances in high heat flux technologies [1], commercial, consumer-oriented systems continue to focus on aircooling for reasons of reliability, acoustics, cost and portability [2]. In order to support the increasing power … [Read more...]

Adhesion of Thermal Interface Materials for CPU Heatsinks, an Overlooked Issue

 

High performance thermal interface materials (TIMs) inserted between the CPU lid and heatsink - generally referred to as the "TIM2" - provide a reworkable low resistance thermal path in the package stack-up. It is well-recognized that users need to monitor the thermal performance of the TIMs to verify vendor data [1, 2]. Less well-known is that the TIM2 can also mechanically … [Read more...]

Microscale heat transfer

 

Advances in microfabrication processes have led to a continuous miniaturization of Field Effect Transistors (FET) that contain semiconductor (e.g., silicon), insulator (e.g., silicon dioxide), and metallic (e.g., copper interconnects) layers only a few nanometers thick. Ever increasing demand for faster microprocessors and the continuous trend to pack more transistors on a … [Read more...]

Piezo actuators for electronics cooling

 

Introduction Today, there is a specific demand by the electronics consumer market: more devices using low power processors with multiple simultaneous CPU functions. Due to the significant demand in computing needs, the International Technology Roadmap for Semiconductors (ITRS) 2005 predicts an increase in the overall power consumption for some platforms [1]. The cooling issues … [Read more...]

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