Introduction Heat from electronic devices is an integral part of information processing, not a nuisance that can someday be eliminated. This is a physical principle that is independent of the device of information processing. However, when viewed in the historical perspective, the severity of heat problems has not monotonically increased. It came to the fore some time ago, … [Read more...]
Packaging Challenges For High Heat Flux Devices
Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in the packaging of processors. This results not only from the fact that processors typically have the largest overall power dissipation in a … [Read more...]
So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages
Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use of multi-chip packages (MCPs) enables miniaturization of a circuit when it is not practical to incorporate all of the desired functionality on a single chip. The … [Read more...]
Solid-State Microrefrigerator on a Chip
Introduction Temperature control of microelectronic devices has become more important in recent years. Device miniaturization and higher switching speeds have increased power dissipation substantially. Limiting the maximum die temperature has resulted in an increase of packaging complexity and cost. The failure rates resulting from electromigration and oxide breakdown are … [Read more...]
Thermal Conductivity of Solders
Soldering has been a primary method of establishing mechanical and electrical connections in electronics for many years and will likely be used in this fashion in the future. While there are several physical properties and characteristics of solders that are of interest to the electronics community at large, one of the most significant physical properties to a thermal engineer … [Read more...]
- « Previous Page
- 1
- …
- 307
- 308
- 309
- 310
- 311
- …
- 354
- Next Page »
