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Design of Experiments for Numerical Parameter Studies of Electronic Systems: Optimizing the Cooling Strategy of an Ethernet Switch

 

Introduction As electronic products become more sophisticated and design margins tighten, defining the thermal management strategy early in the design cycle is vital to ensure a cost-effective design for the level of heat dissipation. Optimizing the cooling system for an electronic product can involve juggling many design parameters, such as airflow rate, fan and vent … [Read more...]

Phase Change Material Thermal Properties

 

Table 1. General Solid-Liquid PCM Characteristics [1] When electronics are operated under transient conditions, increasing the thermal capacitance is a useful technique for limiting temperature increases and/or minimizing the performance requirements of a heat sink. One effective method of increasing thermal capacitance is to include a material that undergoes a change of … [Read more...]

Review of Low Profile Cold Plate Technology for High Density Servers

 

Introduction Water cooling of computers was introduced more than twenty years ago, but had disappeared from the mainstream by the mid 1990s. The conversion of chip technology from bipolar to CMOS (complementary metal oxide semiconductor) was the main reason. As chip powers continue to increase, water cooling appears likely to become mainstream again. In the current market, the … [Read more...]

Threatened With a Pipe

 

I have become a Heel Dragger. When natural convection was all the rage, I was touting fans. Once fan cooling became the status quo, I started dropping hints about heat pipes and thermoelectric coolers. The technology roadmap showed nothing but higher power ahead, and I would soon need those fancier cooling tools. Now everybody senses that this air cooling act is growing stale, … [Read more...]

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