Introduction Microprocessor and system thermal management are linked to facility cooling: power dissipation and cooling techniques employed at one end of the size scale have cascading impacts at the other extreme (Figure 1). For example, ineffective airflow distribution or insufficient underfloor static pressure in a data center can reduce the supply airflow rate from … [Read more...]
Solve Thermal Issues Earlier in Updated Board Designs
Introduction Often new products or product concepts only introduce some new aspects and rely heavily on existing designs. At the board level this often means only one section of a board is retooled or upgraded; an approach that can save significant time and money. Unfortunately, we cannot rely solely on previous work because the interaction of old functions and new features … [Read more...]
Entrance Effects For Heat Flow Into A Multi-Layer Printed Circuit Board
Introduction Since their introduction, multilayer printed circuit boards have provided a significant benefit to the thermal management of IC packages. As is widely recognized, the power and ground planes in these boards function as fins and spread the heat beyond the package footprint and enhance heat transfer to the air. Heat can flow into these planes by conduction either … [Read more...]
Heat Transfer Enhancement By Using Nanofluids For Cooling Of High Heat Output Microprocessor
It is well known that the thermal properties of heating or cooling fluids play a major role in the development of energy-efficient heat transfer equipment. However, conventional heat transfer fluids such as water, ethylene glycol and engine oils have, in general, poorer heat transfer properties than most solids. In spite of considerable research efforts, major improvements in … [Read more...]
Insulated Metal Printed Circuits – A User-Friendly Revolution In Power Design
Introduction The growing pressure to fit as much circuitry into the smallest space possible has created new and more acute thermal problems for the design engineer. More high power components in a smaller space means higher watt densities, which lead to increased heat. As the operating temperatures of components within a design increase, their performance, stability, and life … [Read more...]
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