By now, it is a tired truism to say that the consumer electronics industry has consistently delivered on its promise to provide products that are smaller, faster, and more feature-rich at an ever cheaper price. The main driver for these trends has been the increasing integration of more functions on a single chip. In spite of its greater performance, the PC of today has far … [Read more...]
Thermal Issues in GaAs Analog RF Devices
Wireless communication and advanced radar systems require circuitry that can operate at frequencies greater than 2 GHz and at high power levels. Analog gallium arsenide (GaAs) semiconductors are frequently used in these applications and present additional challenges for thermal engineers compared to silicon semiconductors. Whereas thermal characterization modeling and … [Read more...]
Temperature and reliability in electronics systems – the missing link
To introduce the reliability requirements we face for the future, we focus on telecommunication as an example. Personal telecommunication is becoming increasingly integrated into our daily lives. However, we cannot take full advantage of the technology unless the telecommunication system is as dependable as a car. Just as turning the ignition key should produce the right engine … [Read more...]
The thermal conductivity of rubbers/elastomers
In the May 2001 issue, this column discussed the thermal conductivity of unfilled plastics. The interested reader may have noticed that the category of rubbers/elastomers was missing. This was not without reason. The user of these elastic materials should be aware that the final thermal resistance (which is, of course, from an engineering point of view, the more important … [Read more...]
Thermal management of highly integrated electronic packages in avionics applications
The packaging and thermal management of electronic equipment has become an important issue because of increased power levels and the simultaneous miniaturization of the devices. With the advent of denser device packaging and faster intrinsic speeds, cost, reliability and size have been improved, but, unfortunately, packaging and thermal management have not followed at the same … [Read more...]
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