Thermal experts generally view thermal resistance as a measurable property of a semiconductor device. A system designer, who designs an appliance, is usually not a thermal expert. The system designer just needs a way to determine the size of the external heat sink. At high heat sink temperatures, less power dissipation is allowed in the device. The ratio at which case … [Read more...]
We still have a headache with Arrhenius
"We have a headache with Arrhenius" was attributed to Takehisa Okada, Senior General Manager of Sony Corporation, when asked about Sony's perspective on reliability prediction methods during a U.S. Japanese Technology Evaluation Center visit.[1] The thermal environment is an important consideration in the design of electronics. Temperatures that arise during the use of … [Read more...]
Determining the junction temperature in a semiconductor package, part IV – localized heat generation on the die
In the standard thermal test environment, thermal test chips are designed to dissipate the applied power uniformly over most of the die surface. However, in many situations of practical interest, the power is dissipated over a localized area of the die. This column provides calculation methods to deal with the latter situation. Figure 1 illustrates the situation of interest … [Read more...]
High accuracy thermal interface resistance measurement using a transient method
Heat dissipation of active devices has become one of the limiting factors in further miniaturization. While component manufacturers succeed in decreasing the overall thermal resistance of their packages, the thermal interface resistance to the board becomes the next limiting factor. Therefore, understanding interface and contact resistances becomes increasingly important for … [Read more...]
Low temperature electronic cooling
The potential for low temperature enhancement of CMOS performance has been recognized for some time, going back as far as the late 1960's and mid-1970's. A collection of articles focusing on low temperature electronics is included in the book by Kirschman(1) where a number of researchers [2-6] have identified the advantages of operating electronics at low temperatures. Jaeger … [Read more...]
- « Previous Page
- 1
- …
- 334
- 335
- 336
- 337
- 338
- …
- 355
- Next Page »
