Thermal Design is one of the most challenging aspects of computer system design. This is definitely the case when it comes to designing for “fault tolerance” and “high availability” in high-speed multiprocessor-based systems. The inherent challenges associated with fault tolerance not only bring demanding design requirements but headaches as well. The term fault tolerance … [Read more...]
Use of thermal analysis information in avionics equipment development
IEEE Standard 1332-1998 [IEEE 1998] requires that, "The [equipment] supplier shall determine the customer's requirements and product needs," and that, "The [equipment] supplier, working with the customer, shall include the activities necessary to ensure that the customer's requirements and product needs are fully understood and defined, so that a comprehensive design … [Read more...]
Adjusting temperatures for high altitude
Many companies design products with electronics that must function reliably at high altitude, typically 1,500m (5,000 ft) or 3,000m (10,000 ft) above sea level. Estimating the increase in operating temperatures is necessary to design and qualify such products. There are a variety of corrections used to account for this effect, many of which sacrifice accuracy for simplicity. … [Read more...]
Design and reliability considerations in avionics electronics packaging
In the avionics industry, regulatory agencies and standards organizations, such as Federal Aviation Regulation (FAR) [1], Aeronautical Radio, Inc. (ARINC) [2], and Radio Technical Commission for Aeronautics (RTCA) [3], have developed sets of test procedures that help design engineers test and verify their designs and prevent any safety-threatening failures. Too often, however, … [Read more...]
Determining the junction temperature in a plastic semiconductor package, part II
In the majority of applications involving plastic surface-mount packages, most of the heat generated by integrated circuits will flow to the printed circuit board (PCB) by way of the package leads and then to In higher-power applications it is often necessary to attach a heat sink to the top of the package to keep the junction temperature of the chip within specified limits. … [Read more...]
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