Introduction Increased performance in electronic systems along with higher packaging densities have made temperature a critical parameter. Measurements of temperature, velocity and heat transfer in electronic systems are challenging due to complex materials, configurations, and non-isothermal flows. Earlier articles have considered different aspects of thermal measurements. … [Read more...]
Recent Japanese thermal solutions for portable computers
Introduction Mobile computing is poised to shape the way we live our lives, allowing people to generate, retrieve, and process data anywhere and at any time. The infrastructure for mobile computing is rapidly developing, as evidenced by the recent growth of cellular phone networks and a constant stream of innovations in portable electronic equipment. Mobile computing is also … [Read more...]
Conduction heat transfer in a printed circuit board
In this issue, we examine heat flow in a printed circuit board (PCB), which typically is a layered composite consisting of copper foil and a glass-reinforced polymer (FR-4). A cross-sectional view of such a laminated structure is illustrated in Figure 1. The Figure indicates the numbering system that will be used for indicating the different layers, numbered 1 through to … [Read more...]
Forced convection cooling inside an electronics enclosure
Introduction One of the more complex thermal problems in electronics is the modeling of complete systems, such as an enclosure containing electronic components. A typical example would be a power supply, including heat sinks and a cooling fan. This problem becomes more difficult when there are multiple heat sinks and other large components arranged in an arbitrary manner inside … [Read more...]
Interaction of the system and module-level thermal phenomena- a flip-chip/BGA example
Fig. 1: Levels in a computer environment. Introduction Increasing demands for higher performance in microprocessors have a direct effect on chip power and heat generation. Increased function and miniaturization of the packages result in thermal challenges that require a thorough understanding of the system's thermal performance under all possible field conditions. Regardless … [Read more...]
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