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Measuring fluid velocity in electronic enclosures

 

Thermal analysis and characterization of electronic systems requires a knowledge of fluid velocity. In pursuit of this information, we often resort to measurement or calculation. The issue of measurement becomes a challenge since we are dealing with rather complex flows that tend to be highly nonisothermal. Therefore, it is our intention in this article to highlight the need … [Read more...]

Coefficient of thermal expansion

 

As complexity increases and dies and packages become even larger, temperature gradients also increase, leading to problems with thermal mismatch. Hence, thermomechanical analysis grows in importance. Apart from the temperature differences, the most important parameter describing thermally induced stress is the coefficient of thermal expansion (CTE, or °), expressed in units of … [Read more...]

Highly emissive ion beam textured surfaces for improved cooling of electronic devices

 

Continuous improvements in the cooling of electronic systems will berequired to keep pace with the rapid development of higher power chips.Currently, effective cooling relies (in part) on high surface area heatexchangers. Further improvements could be realized by increasing thesurface area of these devices. However, increasing the size of heatexchanger components is not a … [Read more...]

One-dimensional heat flow

 

The simplest heat flow situation is that described as “one-dimensional heat flow”. The Figure illustrates a one-dimensional heat flow situation. It shows heat flowing in one face of an object and out the opposite face. Each face is at a uniform temperature. There is no heat flow out of the sides of the object. The cross- sectional area of the object in the direction of heat … [Read more...]

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