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Electronics Cooling

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Highly emissive ion beam textured surfaces for improved cooling of electronic devices

 

Continuous improvements in the cooling of electronic systems will berequired to keep pace with the rapid development of higher power chips.Currently, effective cooling relies (in part) on high surface area heatexchangers. Further improvements could be realized by increasing thesurface area of these devices. However, increasing the size of heatexchanger components is not a … [Read more...]

One-dimensional heat flow

 

The simplest heat flow situation is that described as “one-dimensional heat flow”. The Figure illustrates a one-dimensional heat flow situation. It shows heat flowing in one face of an object and out the opposite face. Each face is at a uniform temperature. There is no heat flow out of the sides of the object. The cross- sectional area of the object in the direction of heat … [Read more...]

A simple method to estimate heat sink air flow bypass

 

Introduction After selecting or designing a heat sink based upon a given air velocity orvolumetric flow rate through the fins, the thermal designer needs to determinethe total amount of flow which must be delivered in the duct or card passagecontaining the module w with heat sink. As shown in Figure 1, some of the flowwill go around or bypass the heat sink. In fact, depending … [Read more...]

Calculating interface resistance

 

Figure 1. Ceramic Package - Aluminum Heat SinkAssembly Introduction The exposed surface area of many of today's high powered electronic packagesis no longer sufficient for the removal of the heat generated during normaloperation. Heat sinks are a commonly-used, low cost means of increasing theeffective surface area for dissipating heat by means of convective air cooling.While … [Read more...]

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