Introduction Telecommunication satellites are all based on the same overall design usinga 3 axis stabilization process, in which the North and South panels act asradiators and so ensure heat removal. This basic principle is illustrated in Figure 1. The ever-increasing demandfor national and international space-based communications in parallel with theevolution of space … [Read more...]
Thermal Interface Materials
Thermattach thermally conductive adhesivetapes Introduction Today's semiconductors, whether discrete power or logic ICs, are smaller,run faster, do more and generate more heat. Some microprocessors dissipatepower levels that were once the exclusive domain of discrete power devices,namely 10 to 25 watts. These power levels require thermal management techniquesinvolving large … [Read more...]
Thermal resistance of interface materials as a function of pressure
A very large factor in reducing thermal interface resistance is theapplication of pressure. Even though much effort in recent years has beendevoted to improving the thermal conductivity of interface materials, thethermal conductivity of a material is only a piece of the heat transfer puzzle. As shown in Figure 1, the thermal resistance created by the material itself(RM) for a … [Read more...]
Direct liquid immersion cooling for high power density microelectronics
Introduction Since the development of the first electronic computers in the 1940s, thedevelopment of faster and denser circuit technologies and packages has beenaccompanied by increasing heat fluxes at the chip and package levels. Over theyears, significant advances have been made in the application of air coolingtechniques to manage increased heat fluxes. Although air cooling … [Read more...]
How to evaluate fan life
Convection air cooling is still the most commonly used method of coolingmicroelectronics. In order to deliver air cooled computer equipment with higherreliability, we need to focus on the life expectancy of the air moving devices(AMDs). However, this is not a trivial exercise because there are so manyvariables and there is no industry standard for AMD life test procedures. … [Read more...]
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