Background The cooling of electronics and telecom equipment is essential to the proper operation of all applications. Removal of generated heat from these systems has been traditionally carried out via heat conduction/convection techniques. Phase Change Materials (PCMs) are a relatively new concept for the cooling of electronic systems. A PCM is used to absorb peak energy … [Read more...]
Thermally Conductive, Flame Retardant Epoxy Adhesive for Avionics
Master Bond’s EP93AOFR is a two-part thermally conductive epoxy adhesive that offers superior heat dissipation for a wide range of electronic applications. It can be used in encapsulation and potting applications, as well as in bonding, sealing, and coating. According to Rohit Ramnath, Senior Product Engineer, "This flame retardant non-halogenated system is not only … [Read more...]
SimScale is Teaching Engineers How to Use Web-based CFD Simulation for Electronics Cooling
Munich, February 13, 2019 — SimScale is announcing a free webinar on 19th of February to teach engineers how to ensure efficient cooling, test multiple design versions and prevent thermal damage in electronics design. CFD simulation of a water-cooled electronic device (Source: SimScale) In the electronics industry, neglecting to effectively cool a component within a … [Read more...]
Using Wide Bandgap Materials in Power Electronics Presents a New Set of Thermal Challenges
The power electronics industry has reached the theoretical limits of silicon and now is moving to other semiconductor materials whose performance meets the requirements of today’s high power density systems. A number of techniques are being used to overcome the thermal limitations of power modules. One approach is using semiconductor materials which are able to bypass Si’s … [Read more...]
Heat Exchangers Cool Electrical Enclosures, Keep Dust Out
Industrial air conditioner units are typically the solution for cooling sealed enclosures. What designers sometimes fail to consider, however, is that a cooler ambient environment could be used to help cool warmer electrical enclosure, particularly when there is a temperature difference between the internal target temperature and the surrounding temperature of ∆T≥10°C. … [Read more...]
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