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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

 

INTRODUCTION Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance with Moore's Law [2], power could double within the next few … [Read more...]

Metal Foam Heat Exchangers

 

Reticulated Metal Foams (RMF) are cost-effective and ultra-high-performance thermal management materials that can be integrated with electronic devices and modules. RMFs are compatible with DI water, inert fluoro-carbons, jet fuel, and inert gases.   STRUCTURE OF RMF There are quite a few ways to fabricate RMF [1], however the investment casting method of … [Read more...]

Fluke Ti400 PRO and Ti300 PRO Infrared Cameras

 

Even more of our bestselling cameras just got better  Introducing the new Ti300 PRO and Ti400 PRO, adding to the Fluke PRO series infrared cameras. Navigate the cameras easily with our smartest, most intuitive user interface. Capture tiny heat differences, with increased thermal sensitivity, on-screen clarity, and compatibility to 4 lenses. Learn more … [Read more...]

Fluke RSE300 and RSE600 Infrared Cameras

 

When there's more to infrared than meets the eye Introducing the first ever fully-radiometric, mounted Fluke infrared cameras, equipped with advanced features and software plug-ins to MATLAB® and LabView®. Designed for research, science and engineering, the RSE300 and RSE600 offer the image quality and data analysis capabilities to enhance quality assurance, testing and … [Read more...]

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