BACKGROUND In a proposal submitted to the Air Force in November of 1968, Collins Radio Company described ways to improve the electronic industry’s understanding of thermal management and predictive techniques [1]. This article briefly describes that proposal and discusses what aspects of electronics cooling have changed over the past five decades and what things have … [Read more...]
Enhanced Power Cycling Thermoelectric Modules Provide 1 Million Temperature Cycles
Global technology leader Laird has improved its advanced PC Series Power Cycling thermoelectric module (TEM) for applications that require high reliability and high volume thermal cycling between multiple temperature set points. The enhanced PC Series is now proven to perform more than 1-million temperature cycles, extending the mean time between failure (MTBF) in molecular … [Read more...]
Custom Liquid Cooling Systems Optimize Particle Accelerators Performance
Global technology leader Laird has developed self-contained liquid cooling systems (LCS) that deliver optimal temperature stabilization for more precise temperature control in particle accelerators like linear accelerators (LINACs) and cyclotron systems. LINACs and cyclotrons increase the kinetic energy of particles for use in a variety of applications, ranging from scientific … [Read more...]
Thermally Conductive Laminate Material for Demanding PCB Applications
Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, has added to its extensive thermally conductive laminate and prepreg range with the launch of the VT-5A2, a next generation best-in-class, high Tg thin-core and prepreg material. VT-5A2 is designed for the world's most thermally demanding PCB (Printed … [Read more...]
Application of Metallic TIMs for Harsh Environments and Non-flat Surfaces
Co-authored by: David L. Saums and Tim Jensen DS&A LLC and Indium Corporation INTRODUCTION Electronic systems, implemented in such diverse industries as aerospace, vehicle, geothermal exploration, and mobile devices with a range of more challenging application conditions, create new challenges for component and material reliability. Non-flat mounting conditions, … [Read more...]
- « Previous Page
- 1
- …
- 62
- 63
- 64
- 65
- 66
- …
- 356
- Next Page »
