Co-authored by: Feng Zhou, Shailesh N. Joshi, Ercan M. Dede Electronics Research Department, Toyota Research Institute of North America, 1555 Woodridge Ave., Ann Arbor, MI 48105, US INTRODUCTION In 2012, vehicle fuel-efficiency standards were announced that require all US cars and light trucks to reach 54.5 miles per gallon on average by model year 2025. As a result, … [Read more...]
Thermal Management and Safety Regulation of Smart Watches
ABSTRACT A smart watch is one of the most popular wearable devices now. Along with battery life and security, thermal safety is the most common concern. We show how to meet the ergonomic standards for users and predict thermal performance in typical scenarios. Thermal simulation software applied at the design stage can provide guidance on the use of heat spreading materials … [Read more...]
Advanced ETRI 120-mm EC Axial Fan With Winglet-Style Blades Introduced
The new ETRI Model 125E electronically commutated (EC) axial cooling fan recently introduced by Rosenberg is easier to specify, performs better and offers longer life than competitive products. Its advanced design makes it a perfect choice for VFD cooling, electronic cabinet cooling and small refrigeration applications. The compact 120x120x38 mm ETRI-brand fan features a … [Read more...]
New Laminates Introduced for 5G and Other Millimeter Wave Applications
Rogers Corporation is pleased to introduce CLTE-MW™ laminates. These laminates are ceramic filled, woven glass reinforced PTFE composites. CLTE-MW laminates were developed to provide a cost effective, high performance material for the circuit designer. This unique laminate system is well suited for applications that have limitations in thickness due to either physical or … [Read more...]
Reliability of Nano-sintered Silver Die Attach Materials
Coauthored by: Ross Wilcoxon, Mark Dimke, Chenggang Xie Rockwell Collins INTRODUCTION Die attach can play a significant role in the package level thermal resistance of wire bonded devices. Die with moderate heat flux can often be attached to the carrier substrate with organic, Silver Filled Die Attach (SFDA) materials that require relatively benign processing requirements … [Read more...]
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