The proliferation of digital cameras and their subsequent modular integration in mobile communication and hand-held devices has made today’s photography almost trivial. The latter, i.e., the integration in mobile and hand-held devices is largely made possible by advancements in imaging technology as well as miniaturizing optics and the requisite electronics. Most camera … [Read more...]
SDP-5040-A/B Gap Fillers To Advance Thermal Management Applications
In and effort to increase the options available to thermal engineers in the growing market for silicone TIM (Thermal Interface Materials), Shin-Etsu Silicones of America, Inc. (SESA: A U.S. subsidiary of Shin-Etsu Chemical Co. Ltd., Japan) recently premiered its SDP-5040-A/B Gap Filler product. The non-adhesive product is part of the high performing SDP Series which are Two … [Read more...]
New Liquid Cooled Amplifiers
AR, the world leader in supplying high power, broadband amplifiers, can now supply chillers for any of its standard liquid-to-liquid cooled amplifiers. This capability ensures amplifier performance in any operating condition, reduces the risk of inappropriately sized equipment, and eases the procurement process by working with only one vendor. Each chiller is sized for the … [Read more...]
University of Toronto Selects CoolIT Systems to Liquid Cool Signal Processor for CHIME Project
Calgary, AB. November 10, 2016 – CoolIT Systems, the world leader in energy efficient liquid cooling solutions for the HPC, Cloud and Enterprise markets, has been selected by the University of Toronto to provide custom liquid cooling for its new signal processing backend which will support Canada’s largest radio telescope, the Canadian Hydrogen Intensity Mapping Experiment … [Read more...]
DuPont Launches New Portfolio of Electronic Thermal Management Solutions
DuPont Electronic Materials has recently announced the launch of a new portfolio of thermal solutions under the brand name DuPont™ Temprion™ thermal management materials. The Temprion™ portfolio is completely non-silicone and currently includes thermal greases, thermal gap fillers, electrically insulating films and adhesive thermal tapes. These new thermal management … [Read more...]
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