By George Meyer, Celsia Inc. Introduction This article is intended to offer design guidance when using heat pipes for the most prevalent types of electronics applications: mobile to embedded computing and server type applications with power dissipation ranging from 15 W to 150 W using processor die sizes between 10 mm and 30 mm square. Discussion is constrained to … [Read more...]
Tech Brief: Commercially-available Thermally Enhanced Polymer Composite Materials Characteristics
Peter Rodgers, Editor Valérie Eveloy, The Petroleum Institute Introduction The development, characterization, and implementation of polymer composite materials for the thermal management of electronic equipment has recently began to attract attention [1,2]. The enhanced thermal conductivity, low density, low cost, ease of manufacture and corrosion resistance of polymer … [Read more...]
Temporary Bonding Adhesive for Thin Wafer Handling Introduced
AI Technology has developed specialized tools and equipment to handle thin wafers and thin reconstituted wafers. A series of temporary bonding materials can process temperatures up to 150 Cº, and are well accepted for grinding, dicing, etching, and deposition. AIT’s high temperature wafer processing adhesives (WPA) handle higher temperature processing, and can withstand … [Read more...]
IC Coolers for Limited-Space Requirements
Jaro’s new IC Coolers are ideal for limited-space requirements and designed with BGA, graphic, embedded processors and other IC packages in mind. They are intended for PCMCIA, PCI express cards, blade servers, and all hot chip sets. The V6X090 model (70 x 58 x 12mm) offers 70,000 hours MTBF, with a very quiet operation. The IC Coolers are powerful, lightweight, open-fin, and … [Read more...]
New DoE Efficiency Standard for Pumps
(August 8, 2016) The minimum efficiency standards for general-purpose, three-phase motors have been raised. “The U.S. Department of Energy (DoE) recently released new efficiency standards for commercial and industrial pumps that are based on efficiency levels negotiated by manufacturers, efficiency advocates, and other stakeholders,” reported MachineDesign.com, “In addition to … [Read more...]
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