The Laird™ Ttape™ 1000A thermally conductive adhesive tape delivers best-in-class thermal resistance WILMINGTON, Del., June 3, 2022 - Laird Performance Materials, part of DuPont Interconnect Solutions, has capitalized on collaborative innovation with DuPont to introduce Laird™ Ttape™ 1000A thermally conductive adhesive tape, a standalone 50µm adhesive that offers extremely … [Read more...]
Why Chemical Compatibility Is Vital To Your Liquid Cooling System
Power densities in electronic subsystems continue to increase, driving demand for more extreme cooling power alternatives that increasingly include liquid cooling as a viable candidate. To optimize thermal management efficiency, sustainability and reliability, designers of systems that use liquid cooling are exploring innovative combinations of component materials, including … [Read more...]
Confidence Intervals
The previous articles in this series [1, 2] described how the mean and standard deviations of a set of data are calculated and how they can be used to estimate the characteristics of a population using the normal distribution. Since measured data typically represents only a subset of an entire population, one should recognize that the estimated mean and standard deviation … [Read more...]
Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment
Osaka, Japan - Panasonic Corporation announced today that its Industry Company has developed MEGTRON 8[1] Multi-Layer Circuit Board Materials Featuring Low Transmission Loss [2], designed for high-speed communication networking equipment such as routers and switches. The worldwide deployment of the fifth-generation mobile communication system (5G) is fostering the trend of … [Read more...]
Fan Cooling – Part 1: Determining Flow Rate
Authored by Ross Wilcoxon and Genevieve Martin Associate Technical Editors for Electronics Cooling For a number of reasons, including cost, simplicity, power consumption, noise, etc., natural convection is the preferred approach for cooling electronic systems. However, it is often the case that natural convection is simply not sufficient to remove dissipated power … [Read more...]
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