Researchers at the University of Innsbruck in Austria have proposed a theory that the heating effect in quantum cascade lasers—semiconductor-based devices that emit infrared radiation—could be reversed through a modification of the thickness of semiconductor layers. The new theory may assist with the development of an internal cooling mechanism for certain types of lasers and … [Read more...]
Research Suggests Lasers Can Improve Cooling of Semiconductors
Researchers at Lehigh and Johns Hopkins Universities have achieved the best ratio to date between opposing types of light-scattering phenomena that occur in semiconducting materials. Yujie Ding, professor of electrical and computer engineering at Lehigh University, suggests that the discovery could lead to smaller, lighter and cheaper communication devices with faster switching … [Read more...]
Company Awarded Patents for Thermal Management in Semiconductor Applications
Sp3 Diamond Technologies, Inc., a developer of CVD hot filament diamond deposition reactors and diamond-based solutions for electronics thermal management, has been awarded two patents by the United States Patent and Trademark Office for its DiaMatch™ coefficient of thermal expansion (CTE) matched heat spreader technology. DiaMatch™ is a diamond-based multilayered structure … [Read more...]
Semiconductors Grown on Graphene May Change Industry
CrayoNano AS, in cooperation with the Norwegian University of Science and Technology (NTNU), has introduced GaAs nanowires grown on graphene, a patented hybrid material with competitive properties. The patented method of growing semiconductor nanowires on atomically thin graphene uses MBE (Molecular Beam Epitaxy) to grow the nanowires and offers excellent optoelectronic … [Read more...]
Improved Thermal Management in Power Semiconductors with LL Packages
StratEdge Corporation, high-performance semiconductor package maker for microwave, millimeter-wave, and high-speed digital devices, launched the LL family of high-power laminate packages. The LL leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high-power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and … [Read more...]
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