Silicon dioxide (SiO2) is one of the most common and also one of the most important materials in the world as it is the basis for our windows, beaches and wine glasses. It is also a source of silicon, of course. As such, the thermal conductivity (TC) of the bulk material is well documented. However, in many cases of interest to the thermal management of semiconductors (for … [Read more...]
Thermal Vias – A Packaging Engineer's Best Friend
Introduction In the 1990's, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the different metal layers, vias are fabricated [1]. In most cases vias are hollow cylinders of copper, created by plating a … [Read more...]
The Temperature Ratings Of Electronic Parts
Introduction Semiconductor parts are most often specified for use in the "commercial" 0 to 70°C and, to a lesser extent, in the "industrial" -40 to 85°C operating temperature range. These operating temperature ratings generally satisfy the demands of the dominant semiconductor customers in the computer, telecommunications, and consumer electronic industries. There is also a … [Read more...]
Optical Measurement Of Flip-Chip Package Warpage And Its Effect On Thermal Interfaces
Warpage of FC-PBGA Packages Flip chip technology has emerged as an important chip-level package solution to meet the ever-increasing demand of high I/O requirements. The flip chip technology was implemented originally for a multi-layer ceramic substrate. In the ceramic flip chip package, a shear strain in each bump, produced by the mismatch of the coefficient of thermal … [Read more...]
Thermal Calculations for Multi-chip Modules
Due to the flexible manufacturing processes for producing BGA packages, there has been an explosion of new package designs, many of which contain more than one integrated circuit chip [1]. Existing industry standards for IC package thermal characterization apply only to single-chip packages. This Calculation Corner will present some techniques for calculating the junction … [Read more...]
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