Thermal imaging of microscopic targets has evolved over the past 20 years to the point where real time "true-temperature" mapping with 50 milliKelvin sensitivity and 2.75 �m spatial resolution is possible. Recently, the capability to study and evaluate high frequency transient pulses has been added. Infrared imaging methods provide unequaled ease and flexibility for … [Read more...]
The Many Flavors of Ball Grid Array Packages
By now, it is a tired truism to say that the consumer electronics industry has consistently delivered on its promise to provide products that are smaller, faster, and more feature-rich at an ever cheaper price. The main driver for these trends has been the increasing integration of more functions on a single chip. In spite of its greater performance, the PC of today has far … [Read more...]
Thermal Issues in GaAs Analog RF Devices
Wireless communication and advanced radar systems require circuitry that can operate at frequencies greater than 2 GHz and at high power levels. Analog gallium arsenide (GaAs) semiconductors are frequently used in these applications and present additional challenges for thermal engineers compared to silicon semiconductors. Whereas thermal characterization modeling and … [Read more...]
Thermal management of highly integrated electronic packages in avionics applications
The packaging and thermal management of electronic equipment has become an important issue because of increased power levels and the simultaneous miniaturization of the devices. With the advent of denser device packaging and faster intrinsic speeds, cost, reliability and size have been improved, but, unfortunately, packaging and thermal management have not followed at the same … [Read more...]
Vapor Compression Cooling for High Performance Applications
Vapor compression refrigeration is being adapted to cool computer and telecommunications equipment in a limited number of high performance applications. Vapor compression can lift large heat loads and can heat sink at below ambient temperatures. Cold plates can offset high case-to-junction temperature gradients to keep high power integrated circuits from overheating and/or can … [Read more...]
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