Authors: Jesse Galloway, Reliability and Thermal Engineer Consultant Robin Bornoff, Innovation Roadmap Manager ______________________________________________________________________________________________ Thermal characterization plays a vital role in electronic package reliability testing, design, and verification of manufacturing processes. The reliability of … [Read more...]
Report About the THERMINIC 2023 Workshop
By: Marta Rencz, Andras Poppe, and Genevieve Martin The 29th issue of the THERMINIC (Thermal investigations of ICs and Systems) workshops was held on 27-29 September 2023 in Budapest, Hungary at the Budapest Marriott Hotel. Over 110 participants enjoyed the high quality presentations from 17 countries. About half of the participants came from the industry, half from the … [Read more...]
Summary of the IEEE ITherm 2023 Conference
The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the JW Marriott Grande Lakes, Orlando, FL, May 30 – June 2, 2023. This was the 22nd ITherm, which was first held in 1988. The conference was historically held every other year until 2016 when it switched to an annual schedule. ITherm 2023 was sponsored by the … [Read more...]
Statistics Corner: Weibull Distribution
A little over a pandemic ago, the first article in this series on statistical analysis mentioned that a fundamental aspect of statistics is that one assumes a mathematical model that describes the distribution of a data set and then uses that model to estimate the probability that a given value or set of values will occur [1]. This allows us, for example, to estimate whether … [Read more...]
Heat Transfer and Pressure Drop Correlations for Manifold Microchannel Heatsinks
Written by: Sevket U. Yuruker, Raphael K. Mandel, Amir Shooshtari and Michael M. Ohadi - Department of Mechanical Engineering, University of Maryland Conventional microchannel cooling has been proven capable of removing high heat fluxes, but usually at significant pressure drops. On the other hand, manifold microchannel systems offer high heat transfer coefficients/heat … [Read more...]
- 1
- 2
- 3
- …
- 28
- Next Page »
