INTRODUCTION Militaries continue to expand their use of electronics in harsh environments while preserving an absolute minimal risk of failure. In this regard, effort spent early in the design process on concept development, parametric and trade-off studies, and simulation-driven design can yield amplified benefits in terms of product performance and reliability, reduced … [Read more...]
Thermal Facts & Fairy Tales: 7 years of college down the drain…
...might as well join the Peace Corps… - John "Bluto" Blutarsky1 I would hazard a guess that the majority of people bothering to read an article on electronics cooling likely work in the electronics industry. Moreover, it is probably a pretty good bet that a lot of them have actually taken a class on heat transfer at some point. Since most of us eventually graduated, it … [Read more...]
Thermal Management in Body-Embedded Electronics
We are entering an era where electronics technology is increasingly being integrated with biological systems in vivo. These technology solutions interact with organs and skeletal-, muscular- and nervous-systems of biological entities through hybridization of disparate solutions that merge to serve a common purpose. Biohybrid systems that interface and thus enable the … [Read more...]
Calculation Corner: Spreadsheet-based Matrix Analysis – Extension to Transient Analysis
by Ross Wilcoxon, Ph.D., Associate Technical Editor Over the years, a number of articles [1-3] published in ElectronicsCooling have described the use of thermal resistance networks to analyze electronic systems. The analysis of a thermal resistance network begins by defining discrete nodes that are connected with resistors, with the magnitude of a flow between nodes defined … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
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