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Electronics Cooling

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Redesigned Heat Sinks Using 3D Printers

 

Plunkett Associates has successfully redesigned heat-sinks to improve convection cooling performance using Direct Metal Laser Sintering (DMLS), or 3D printing. “Each heat-sink was first produced in virtual form and simulated using Computational Fluid Dynamics (CFD) software,” reported 3Ders.org. “The top five heat-sinks were then built by 3T RPD Ltd. using DMLS and physically … [Read more...]

Researchers Send De-ionized Water Within Few Hundred Microns of Transistors

 

Researchers from the Georgia Institute of Technology have announced a breakthrough in increasing processing power. “Their innovative design involves sending liquid coolant—in the form of de-ionized water—through microfluidic passages within a few hundred microns of the transistors, allowing chips to operate at temperatures more than 60 percent lower than air-cooled chips,” … [Read more...]

New Technique in Photonic ICs and Optical Computing

 

A new technique could be a big step toward photonic ICs and optical computing, according to researchers at ITMO University in St. Petersburg, Russia. The technique uses a single silicon nanoparticle as an optical transistor. “In research published in the journal Nano Letters, the Russian scientists turned away from using nanoparticles to control the absorption of light and … [Read more...]

Interactive 3D Thermal Heatsink Modeling Simulation Software

 

Yesterday, during the 2015 IEEE ECCE conference and exposition in Montréal, Canada, Mersen presented the R-Tools GEN III. Mersen will show the redesigned interactive 3D Thermal Heatsink Modeling simulation software today, Sept. 22, as well. “R-Tools Gen III is a free on-line simulation software that allows users to model the optimum air cooled heatsink solution tailored to … [Read more...]

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