Daat Research Corporation, a developer of engineering applications for modeling fluid flow and heat transfer, has released a version 12 upgrade for its Coolit computational fluid dynamics (CFD) thermal-analysis software for electronics. According to the company, improvements in computer-aided design (CAD) import were made to the software that will make it easier to navigate … [Read more...]
New Software Added to Computer-Aided Engineering Software Suite
Altair, the developer of the HyperWorks computer-aided engineering software suite, has announced the addition of TES International’s software ElectroFlo to the group of applications available through the HyperWorks Partner Alliance (HWPA). ElectroFlo is an electronics cooling package with a user-friendly graphical interface used for the thermal analysis of electrical components … [Read more...]
Detailed System Level Modeling of LEDs
Introduction Developments in solid state lighting (SSL) in recent years have led to an extensive increase in the driving current of light emitting diodes (LEDs). Although corresponding increases in light output and efficiency has also been noted, current lighting design applications require the implementation of multiple diodes to allow its utilization in universal lighting … [Read more...]
Cloud Computing May Solve Data Center Cooling Cost Issues
InformationWeek Reports, a service provider for peer-based IT research and analysis, recently released its “2012 State of the Data Center” report, which contains the results of its annual State of the Data Center Survey and advice on how companies can best approach the virtualization of hardware and software. According to the data compiled from approximately 256 business … [Read more...]
Calculation Corner: Transient Modeling of a High Power IC Package, Part 2
Part 1 can be found here. Part 1 of this article provided the groundwork for the present discussion [1]. It demonstrated the use of three different methodologies for performing a transient thermal analysis of a high-power IC package attached to a heat sink. These include the finite element analysis (FEA) method and a numerical model, which represents the package and heat sink … [Read more...]
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