Part 1 can be found here. Part 1 of this article provided the groundwork for the present discussion [1]. It demonstrated the use of three different methodologies for performing a transient thermal analysis of a high-power IC package attached to a heat sink. These include the finite element analysis (FEA) method and a numerical model, which represents the package and heat sink … [Read more...]
Calculation Corner: Transient Thermal Modeling of a High-Power IC Package, Part 1
Part II can be found here. There is an increasing need for calculating integrated circuit temperatures during conditions of changing chip power. Varying computer workloads and the implementation of power-saving strategies are leading to greater variability in chip power levels than in the past. As reliability requirements get more stringent there are growing concerns about the … [Read more...]
Efficient Electro-Thermal Simulation of Power Semiconductor Devices via Model Order Reduction
Thermal management is an increasingly important consideration in the development of power electronic systems. Electro-thermal simulation is required at the system level in order to ensure under realistic loads the fulfillment of thermal requirements, which strongly influence the performance, reliability and efficiency. A significant modeling issue is to obtain a compact but … [Read more...]
Strategies for Using Thermal Calculation Methods
Thermal analysis tools available to engineers and scientists offer a wide variety of methods to solve problems. A cursory review of the past decade’s issues of ElectronicsCooling magazine can show methods ranging from analytical techniques (such as hand calculations) to spreadsheets to full numerical/computational solutions such as CFD (Computational Fluid Dynamics) and FEA … [Read more...]
Using Simulation to Improve Data Center Efficiency
This paper describes a new CFD-based modeling capability and design methodology that overcomes the limitations of conventional guidelines and traditional CFD-based approaches and is effective at addressing equipment related cooling and efficiency problems in the data center. Depending on circumstances, 30-50% improvement in cooling system efficiency can be achieved by this … [Read more...]
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