Corsair’s new Link™ technology allows multiple Corsair products to be connected to the Corsair Link Controller, providing enhanced measurement and control capabilities. Corsair products that includes a Corsair Link connector can be linked to the Controller and report key parametric data, such as temperature, fan speed, pump speed, voltage, power consumption, etc., which can … [Read more...]
Software Modeling to Determine Heat-Related Problem Spots
Managing heat generation and dissipation in today’s compact and complex electronic world requires the attention of designers and manufacturers alike. It is also a system-wide problem, because optimizing a thermal problem in one area—whether it’s package, board or enclosure—rarely ensures the entire system will be optimized. Past techniques to determine heat-related problem … [Read more...]
Firm Receives Contracts for U.S. Navy Gun Computer System Cabinets
The Electronics Group of Orbit International Corp, an electronics manufacturer and software solution provider, has received several awards from a U.S. Navy Procurement Agency valued in excess of $2,465,000 for its MK 119 Gun Computer System Cabinet (GCSC) and MK 437 Gun Mount Control Panels (GMCP). The MK 119 GCSC is an unmanned, environmentally-isolated shipboard enclosure … [Read more...]
technical brief: thermal bottlenecks and shortcut opportunities; innovations in electronics thermal design simulation
Introduction Cooling an electronics system involves transferring heat from various heat sources to the outside ambient. Thermal simulation software provides practitioners with predictions of the temperature and heat flux distributions in and around the system, making it easy to assess the impact of design changes. While the raw simulation results enable us to measure and … [Read more...]
The Uses of Simplicity in Thermal Analysis
Bruce Guenin, PhD Editor-in-Chief, Summer 2010 Issue The dramatic trajectory of Moore’s law has produced a number of changes in key areas of technology that are critical to our industry: 1) greater packaging and system complexity; 2) increased power dissipation; and 3) enhanced software tools and computing performance. The first two we put into the challenge category. They … [Read more...]
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