Innovative Research, Inc. recently released TileFlow 4.2, a new version of its three-dimensional software tool for simulating cooling performance of data center. TileFlow now allows users to include upflow CRAC units in the data center layouts. For these units, the dimensions, the details of the return and supply openings, the flow rate, and the cooling characteristics are … [Read more...]
CFD: One measly letter away from CAD
"The stuff you engineers design is too good," the guy from Marketing said, "I need shoddier! Can you make them less efficient and cheaper?" I was working for a small company that made electric power conditioning equipment. Our devices protected against spikes, sags and brownouts in the AC power for mission-critical equipment like air traffic control radar and the computer … [Read more...]
Natural convection modeling of heat sinks using web-based tools
Heat transfer in electronic packages is a complex problem involving a network of resistive paths for the various laminated structures, bonding adhesives, lead frames, and attachment mechanisms, such as ball grid arrays. However, despite the multitude of materials and interfaces within an electronic package, the largest thermal resistance, and consequently the controlling … [Read more...]
Thermal analysis moves into the 21st century
In the last decade, we've come a long way in the application of thermal analysis to the design of electronics. And there's no sign of the pace of innovation changing. Engineers are still being challenged to build faster, smaller and cheaper products in ever-decreasing design times. Fortunately, the engineering software industry has been able to respond by providing tools that … [Read more...]
Electronic package characterization per JEDEC standard
Introduction With the increase in power density resulting from advancements insemiconductor packaging technologies comes the issue of heat dissipation. Heatis generated as a result of electrical energy being converted to thermal energyduring circuit activities. The junction temperature of a chip directly affectsthe performance of the circuits and the reliability of … [Read more...]