Sponsor

Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

Sponsor

Teledyne to Acquire FLIR Systems

 

  THOUSAND OAKS, Calif. and ARLINGTON, Va. – January 4, 2021 – Teledyne Technologies Incorporated (NYSE:TDY) (“Teledyne”) and FLIR Systems, Inc. (NASDAQ:FLIR) (“FLIR”) jointly announced today that they have entered into a definitive agreement under which Teledyne will acquire FLIR in a cash and stock transaction valued at approximately $8.0 billion. Under the terms of … [Read more...]

Heat-Blocking Defects Detected Acoustically

 

  In the landing gear control module of an aircraft, a high-voltage IGBT is about to fail. In the solder bonding one chip’s ceramic base to its heat sink are three small air bubbles—voids, in the vocabulary of electronic failures. The three voids are close together, and the largest is almost directly under a hot spot on the die. Collectively the voids have diminished … [Read more...]

JEDEC Thermal Standards: Developing a Common Understanding 

 

  JEDEC Thermal Standards: Developing a Common Understanding The Joint Electron Device Engineering Council (JEDEC) was established to provide recognized technical standards for a wide range of applications, from how to handle electronic packages and defining package outline drawings, to the methods used to characterize performance, including thermal. The JC-15 committee … [Read more...]

Cadence Launches Celsius Thermal Solver, Delivering the Industry’s First Complete Electrical-Thermal Co-Simulation for System Analysis

 

Innovative multi-physics technology furthers Cadence’s expansion into fast-growing system analysis and design market SAN JOSE, Calif., September 17, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence® Celsius™ Thermal Solver, the industry’s first complete … [Read more...]

Industry Sponsors

Sponsor
Sponsor