JEDEC Thermal Standards: Developing a Common Understanding The Joint Electron Device Engineering Council (JEDEC) was established to provide recognized technical standards for a wide range of applications, from how to handle electronic packages and defining package outline drawings, to the methods used to characterize performance, including thermal. The JC-15 committee … [Read more...]
Cadence Launches Celsius Thermal Solver, Delivering the Industry’s First Complete Electrical-Thermal Co-Simulation for System Analysis
Innovative multi-physics technology furthers Cadence’s expansion into fast-growing system analysis and design market SAN JOSE, Calif., September 17, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence® Celsius™ Thermal Solver, the industry’s first complete … [Read more...]
Three Thermal Simulation & Test Innovations for Electronics Equipment Design
Over the last 50 years, the automotive industry has been going through huge shifts in electrification (Figure 1). And, of course, we are seeing the electric motor starting to replace the mechanical engine with the advent of Electric & Hybrid vehicles. Not surprisingly, the demand for ever higher density in a confined electronics leads to a greater and greater need to … [Read more...]
10 Must Attend Technical Sessions at SEMI-THERM 35
The 35th Semiconductor Thermal Management conference starts in a week and is being held in Silicon Valley, CA. Electronics Cooling is one of the media sponsors and will have an exhibit booth –stop by to say hello, pick up some literature and chat with us to learn more about what is “hot” in the electronics industry and how it is so “cool” to work on thermal management! … [Read more...]
New Test Enclosure Reduces Audible Noise During Electronics Thermal Testing
Noise Suppressing Enclosure Improves User Experience with a 55% Noise Reduction August 14, 2018 - inTEST Thermal Solutions (iTS), Mansfield, MA (inTESTthermal.com)… iTS, manufacturer of the Temptronic® ThermoStream® air forcing system, has developed an enclosure that provides a 55% reduction in the noise caused by forced air during electronics thermal cycling. Electronics … [Read more...]
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