Je-Young Chang and Ashish Gupta Intel Corporation INTRODUCTION Integration using multi-chip packaging (MCP) is an effective and popular technology option to increase transistor density in one component by integrating two or more dice or other discrete components on a common substrate. For accurate thermal analyses of MCPs, thermal interactions between active components need … [Read more...]
Power Cycle and Thermal Testing of Electronic Components
Mentor Graphics Corporation has released the new MicReD Industrial Power Tester 1,500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance. The MicReD Industrial Power Tester 1500A is ideal for reliability testing of power electronic components used in industries such as automotive and transportation including in hybrid … [Read more...]
Researchers Pinpoint Heat Movement in Nanostructures
Researchers at Cornell University have developed a new method of precisely measuring the subtle movement of heat in nanostructures. Heat flows at the nanoscale differently than at larger scales, the researchers say, and understanding how certain surfaces affect the transport of heat at the phonon level could have implications in everything from thermoelectric materials to … [Read more...]
TTI Analyzers Offer Low-Cost Solution for Non-Invasive Thermal Design Verification
Microsanj, a supplier of high-resolution thermoreflectance thermal imaging systems, tools and consulting services, has announced the availability of its NT100/NT110 thermoreflectance thermal image analyzers starting at $45,000. The availability of the NT100 sub-micon spatial resolution thermoreflectance thermal imaging system at this price meets the need for a low cost … [Read more...]
Ultra-Thin Titanium Based Thermal Solution for Electronic Applications
Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design of thermal engineering and heat rejection technologies. The need for performance inevitably leads to operation of most … [Read more...]
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