Consumer electronics provider Sony has released the source code for Thermanager, a thermal management solution developed for and used in the company’s Android Open Source Project (AOSP) for Xperia projects. The source code is available through the Sony channel on GitHub. “Since the first release of Android Open Source Project (AOSP) for Xperia devices, thermal management for … [Read more...]
Wind Tunnel for Thermal and Airflow Testing of Multiple PCBs
Omega Engineering has released the new WT-3200 series of wind tunnels for thermal and airflow testing of multiple PCBs. Featuring a 2-D converging nozzle with a multi-point measurement area for sensor placement upstream of the test section, the test chamber can accommodate up to six PCBs with 13 mm (0.5 in) card-to-card spacing or three PCBs with 25 mm (1 in) card-to-card … [Read more...]
Testing of Power LEDs: The Latest Thermal Testing Standards from JEDEC
András Poppe, Ph.D.; Mentor Graphics MAD MicReD Unit The electrical, thermal and optical parameters determining light emitting didoes (LEDs) operation are in a strong, mutual dependence; without knowledge about the parameters in one of these domains the other characteristics cannot be measured correctly. The reliability, useful operating life time and luminous flux are … [Read more...]
Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis
Microsanj, LLC, a supplier of high resolution, thermoreflectance thermal imaging systems, tools and services, has announced the availability of a new addition to the Nanotherm series of thermoreflectance thermal imaging products. The NT100A General Purpose Thermoreflectance Thermal Imaging System was featured last month at SEMI-THERM 2013 in San Jose, Calif. The new thermal … [Read more...]
Thermal Characterization Tools for Testing and Evaluation of TIM Materials
Thermal Engineering Associates, Inc. (TEA) has announced the availability of a new family of thermal interface material characterization tools. According to TEA, the new tools are designed to make the testing and evaluation of TIM materials simpler and more cost-efficient, and are comprised of the company’s thermal test chip—available in sizes ranging from 2.5mm square to … [Read more...]
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