Thermal Engineering Associates, Inc. (TEA) has announced the availability of a new family of thermal interface material characterization tools. According to TEA, the new tools are designed to make the testing and evaluation of TIM materials simpler and more cost-efficient, and are comprised of the company’s thermal test chip—available in sizes ranging from 2.5mm square to … [Read more...]
Thermal Imaging Camera Kit Offers Less Than 50mK Sensitivity
Omega Engineering Inc., a manufacturer of measurement and control instruments for a range of applications, has released thermal imaging camera kit model OSXL-A35SC for thermal benchtop testing applications. According to the company, the new thermal imaging camera kit features “plug-and-play” compatibility, fast data transfer, a wide temperature range and less than 50mK … [Read more...]
Heat Sink Analysis System for Testing Surface Contact and Pressure Distribution
Sensor Products Inc., a developer of tactile pressure sensing solutions, has released the Tactilus heat-sink analysis system for testing surface contact and pressure distribution between the heat sink and heat source. The Tactilus sensor measures 2 x 2 inches and 0.015 (0.38 mm) inches thick with a scan speed of up to 1,000 Hertz and an operating pressure range of 0 to 100 psi … [Read more...]
Intel, South Korean Mobile Carrier Make Temperatures Climb in Data Centers
Intel and South Korean mobile carrier KT have partnered to investigate the possibility of running data centers at a hotter temperature than normal in an effort to reduce the cost of cooling and power. Traditionally, organizations run their data centers at between 64 and 70 degrees Fahrenheit to keep servers from overheating. However, keeping the facilities running at such low … [Read more...]
Spray Cooling Heat Transfer – Test and CFD Analysis
Spray cooling processes yield high heat transfer coefficients due to heat absorption associated with latent heat absorption during liquid-vapor phase transition [1-5]. Spray cooling advantages lie in potentially eliminating TIM1 and TIM 2 thermal resistances, yielding significant reduction in overall thermal resistance. Due to the complexity and chaotic nature of millions of … [Read more...]
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