The creation, transport and storage of digital information are growing at rates of 40% to 50% annually, with video, mobile broadband, and machine-to-machine communication being the main drivers. The implementation of 5G wireless networks is enabling this growth and heralding a new era of revolutionary applications and functionality due to bandwidth increases and communication … [Read more...]
Statistics Corner: Modifying Sample Size
ABSTRACT Reliability verification often requires that a specific number of components be tested to a predetermined level of testing to demonstrate that none of the samples fail. This article describes a statistical approach for justifying the use of fewer samples by subjecting them to a more severe level of testing. BACKGROUND Reliability verification often includes … [Read more...]
Statistics Corner: Weibull Distribution
A little over a pandemic ago, the first article in this series on statistical analysis mentioned that a fundamental aspect of statistics is that one assumes a mathematical model that describes the distribution of a data set and then uses that model to estimate the probability that a given value or set of values will occur [1]. This allows us, for example, to estimate whether … [Read more...]
Heat Transfer and Pressure Drop Correlations for Manifold Microchannel Heatsinks
Written by: Sevket U. Yuruker, Raphael K. Mandel, Amir Shooshtari and Michael M. Ohadi - Department of Mechanical Engineering, University of Maryland Conventional microchannel cooling has been proven capable of removing high heat fluxes, but usually at significant pressure drops. On the other hand, manifold microchannel systems offer high heat transfer coefficients/heat … [Read more...]
Machine Learning Optimization to Boost the Effectiveness of Phase Change Material (PCM)-Based On-Chip Passive Thermal Management
Written by: Dr. Amy Marconnet and Meghavin Bhatasana - Purdue University Although miniaturization of electronic components has helped advance computing power and accelerated technology development, it has increased power densities and exacerbated the already challenging issue of electronics cooling at the component level. Continuous operation at high temperatures degrades … [Read more...]
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