Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package). The LED-business is growing much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterization has not kept … [Read more...]
Numerical Simulation of Complex Submicron Devices
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to the feature size, power densities, and material properties. In semiconductor devices, higher heat flux densities can result from … [Read more...]
A Simple Method to Estimate Boiling Heat Sink Performance
Introduction As most readers of ElectronicsCooling magazine are no doubt aware, fins may be added to a heat transfer surface to increase the effective heat transfer area and thereby reduce the base surface temperature for a given heat load and heat transfer coefficient. The formula to estimate the heat dissipation capability, qf, of a straight fin is given by, and Af is … [Read more...]
Cooling Electronics with Nanofluids: Laminar Convective Heat Transfer
Introduction Numerous reports over the past ten years or so have described the potential for nanofluids (suspensions of nanoparticles in liquids) to be applied as heat transfer fluids, because of the enhanced thermal conductivity and convective heat transfer characteristics that have generally been observed. A number of review articles have been published on nanofluids [1 � 8], … [Read more...]
Power Map Calculations Using Image Sources and Superposition
Introduction In the past, thermal engineers were content to calculate a single junction temperature in the thermal characterization of an integrated circuit chip in a package. In recent years, as power levels have increased, more attention has been paid to the calculation of local temperature variations on a chip. This is necessary to adequately account for high-heat-flux … [Read more...]
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