Thermal energy transfer associated with a change of phase can be a valuable phenomenon for engineers designing systems for electronics cooling. Solid to liquid phase change materials were described in the May 2005 Technical Data column and the topic for this issue is liquid to vapor phase change. The energy required to change a substance from a liquid state to a vapor state is … [Read more...]
Heat Spreading Calculations Using Thermal Circuit Elements
Heat Spreading Calculations Using Thermal Circuit Elements Bruce Guenin, Associate Technical Editor Introduction In electronics cooling applications, there are numerous changes of scale from the chip level to the system level. This is characteristic of the signaling, power, and thermal infrastructures in electronic systems. Because of this, it is inevitable that the heat flow … [Read more...]
Liquid Cooling for Datacom Equipment Centers
Introduction The increasing heat load densities in datacom equipment centers require ever more sophisticated approaches to cooling. Air-cooled systems are now struggling to provide the needed level of thermal performance for many installations and energy efficiency is an increasing concern. In fact, the standard implementation of air-cooled designs results in cooling energy … [Read more...]
Simplified Correlations For Radiation Heat Transfer Rate In Plate-Fin Heat Sinks
Radiation heat transfer can be a significant portion of total heat transfer from a heat sink, particularly in natural convection flows. The enclosures for most natural-convection-cooled indoor and outdoor electronic equipments, such as pole or wall-mount base stations and radio units, include external fins to improve natural convection and radiation heat transfer rates. Early … [Read more...]
Thermal Optimization And Design For Manufacturability Of Liquid-Air Hybrid Cooling Systems
Introduction Existing technologies typically utilize air to carry the heat away from a heat sink that is thermally coupled to the microprocessor. Higher performance devices such as workstations, "gaming" PCs, or tower servers that utilize components with greater power dissipation can require more aggressive cooling technology. A high-performance alternative to heat sinks is a … [Read more...]
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