Introduction Existing technologies typically utilize air to carry the heat away from a heat sink that is thermally coupled to the microprocessor. Higher performance devices such as workstations, "gaming" PCs, or tower servers that utilize components with greater power dissipation can require more aggressive cooling technology. A high-performance alternative to heat sinks is a … [Read more...]
Heat of Vaporization
Thermal energy transfer associated with a change of phase can be a valuable phenomenon for engineers designing systems for electronics cooling. Solid to liquid phase change materials were described in the May 2005 Technical Data column and the topic for this issue is liquid to vapor phase change. The energy required to change a substance from a liquid state to a vapor state is … [Read more...]
Heat Spreading Calculations Using Thermal Circuit Elements
Heat Spreading Calculations Using Thermal Circuit Elements Bruce Guenin, Associate Technical Editor Introduction In electronics cooling applications, there are numerous changes of scale from the chip level to the system level. This is characteristic of the signaling, power, and thermal infrastructures in electronic systems. Because of this, it is inevitable that the heat flow … [Read more...]
2U Rack Mountable Vapor Compression Cooling System For High Power Electronics
Vapor compression refrigeration has long been used to cool telecommunications equipment and some high performance computers. On the whole, however, its usage has been confined to high-value, relatively large, and stationary applications. The advantages of vapor compression cooling (VCC) systems are fairly well known. They can provide heat sinks at below ambient temperatures … [Read more...]
Estimating Dew Point Temperature For Water Cooling Applications
Over the past several years thermal engineers and others in the computer industry have become acutely aware of the challenge of increasing power dissipation and the potential of liquid (principally water) cooling to provide a thermal management solution. A number of articles in ElectronicsCooling have addressed both the issue of increased power dissipation [1-4] and various … [Read more...]
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