Advances in microfabrication processes have led to a continuous miniaturization of Field Effect Transistors (FET) that contain semiconductor (e.g., silicon), insulator (e.g., silicon dioxide), and metallic (e.g., copper interconnects) layers only a few nanometers thick. Ever increasing demand for faster microprocessors and the continuous trend to pack more transistors on a … [Read more...]
Using a simple air recirculation model to explore computer rack cooling
Figure 1. Schematic diagram of simple computer rack air recirculation model. Figure 2. Schematic diagram of computer rack air recirculation model with heat exchanger in rear of computer rack. In an article in the November 2006 issue of ElectronicsCooling it was noted that “advances in computer clusters have resulted in the introduction of higher density server … [Read more...]
The Seebeck Coefficient
In this issue, we address the Seebeck coefficient, a property that determines the performance of thermocouples and Peltier elements. Basically, the Seebeck coefficient is related to the fact that electrons are both carriers of electricity and heat. If a temperature gradient exists over a piece of electrically conductive wire, there is a net diffusion of electrons from the hot … [Read more...]
Thermal Challenges In LED Cooling
Introduction During the last ten years, developments in LED semiconductors have led to an important change in LED applications from that of luminous indicator to that of illuminator. With LEDs now advancing into several lighting fields, LEDs have become one of the standard methods of producing light, joining more traditional sources such as incandescent, fluorescent and … [Read more...]
Toward A Thermal Figure Of Merit For Multi-Chip Packages
Toward A Thermal Figure Of Merit For Multi-Chip Packages Bruce M. Guenin, Ph.D., Associate Editor Introduction Last issue's Calculation Corner dealt with methods for predicting the temperature of each chip in a Multi-Chip Package (MCP) at an arbitrary combination of chip power levels using the principle of superposition [1]. One of the main points of that article was that both … [Read more...]
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