Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use of multi-chip packages (MCPs) enables miniaturization of a circuit when it is not practical to incorporate all of the desired functionality on a single chip. The … [Read more...]
On-Chip Electrowetting Cooling
Introduction Control of component temperatures and temperature gradients is essential for the successful operation and reliability of electronics products [1]. However, conventional cooling methods, such as natural convection or fan-induced air-cooling, cannot cope with the increasing demand for electronics cooling. Therefore, more sophisticated cooling techniques are required. … [Read more...]
Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks
Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today's electronics. In these design situations, the proven method of analytical calculations, modeling, and laboratory testing is sometimes bypassed in the search for a quick "cure-all" solution. Evolutionary progress is … [Read more...]
A Simple Thermal Resistance Model – Isoflux Versus Isothermal
In most cases today thermal design for electronic products is performed with the aid of sophisticated computational fluid dynamics and heat transfer codes. Nonetheless, there may still be occasions when a thermal designer needs a quick estimate of the external thermal resistance of a package or heat sink that does not warrant the use of powerful computer codes. In such cases an … [Read more...]
Indirect Thermosyphons For Cooling Electronic Devices
Nomenclature Variables R Thermal Resistance [°C/W] or [°C-mm2/W] Q Power [W] Q" Heat Flux [W/cm2] T Temperature [°C] or [K] h Heat Transfer Coefficient [W/cm2-K] Subscripts sat saturation tc thermocouple s sink or boiler w wall j junction layer of die a ambient f fluid or saturation c chip surface boil associated with … [Read more...]
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