Silicon dominates the electronics industry as the semiconductor of choice for most applications, but some electrical functions require electronic properties different from those of silicon. A grouping of semiconductors termed "III-V" have desirable electrical properties for applications such as microwave integrated circuits, light emitting diodes and laser diodes. Some of the … [Read more...]
Thermal Design And NEBS Compliance
Introduction As part of contractual and design requirements, telecom equipment destined for certain networks in the North American market has to be tested to the Network Equipment Building System (NEBS) standard and comply with its requirements. NEBS is a standard from Telcordia, formerly known as Bell Communication Research (Bellcore). Technically speaking, NEBS is the … [Read more...]
Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks
Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today's electronics. In these design situations, the proven method of analytical calculations, modeling, and laboratory testing is sometimes bypassed in the search for a quick "cure-all" solution. Evolutionary progress is … [Read more...]
Advances In High-Performance Cooling For Electronics
Introduction The need for new cooling techniques is driven by the continuing increases in power dissipation of electronic parts and systems. In many instances standard techniques cannot achieve the required cooling performance due to physical limitations in heat transfer capabilities. These limitations are principally related to the limited thermal conductivity of air for … [Read more...]
Cooling Solutions In The Past Decade
Introduction In 1995, a typical thermal design engineer was aware that removing heat was not going to get any easier in the next few years. A look back at the past ten years reveals that thermal management remained a challenging field. Fortunately, developments and improvements in thermal management hardware have assisted the electronics packaging community by enabling higher … [Read more...]
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