Introduction When faced with the task of calculating the temperature of an IC in a package, which has an external heat sink mounted to it, a thermal engineer usually obtains a values of three thermal resistances: ΘJC , the junction-to-case thermal resistance for the package, ΘCS , the case-to-sink thermal resistance representing the thermal interface material (TIM) between the … [Read more...]
Liquid Cooling is Back
Introduction IBM announced its return to water cooling on April 19, 2005 with the introduction of a water cooled heat exchanger mounted to the back cover of a 19 inch rack. This is the first of the major datacom equipment manufacturers to employ water cooling for a rack of CMOS processors, using a cooling distribution unit supplying the water and rejecting the heat load to … [Read more...]
Metals For Thin Wires – Criteria Of Choice
When a designer has to deal with thin current-carrying wires, a number of thermal issues pop up: Joule heating, heat losses and temperature measurement. For standard lead wires, one usually wants minimal Joule heating and minimum thermal resistance (in order to maximize the heat losses). Minimization of heat losses may be important for a research environment. Maximum Joule … [Read more...]
CFD Simulations in Electronic Systems: A Lot of Pitfalls and a Few Remedies
Introduction In the past 15 years, we have observed a significant increase in the use of Computational Fluid Dynamics (CFD) codes to calculate the thermal behavior of electronic systems. The benefits are undisputed when it comes to performing parametric studies in early design phases. However, when the objective is accuracy, the discussion about what we can expect in practice … [Read more...]
Design of Experiments for Numerical Parameter Studies of Electronic Systems: Optimizing the Cooling Strategy of an Ethernet Switch
Introduction As electronic products become more sophisticated and design margins tighten, defining the thermal management strategy early in the design cycle is vital to ensure a cost-effective design for the level of heat dissipation. Optimizing the cooling system for an electronic product can involve juggling many design parameters, such as airflow rate, fan and vent … [Read more...]
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